Intel—Hardware Engineer

Job description

Description: Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Job Responsibilities: - Support hardware design of an optical transceiver and evaluation boards meeting product specifications, including schematic capture, circuit simulation, PCB design guidance, DFM review and design verification testing - Expertise in designing 100G/lane and 200G/lane module PCBA, own the schematic and layout execution, experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements - Experience with 100Gbps+ DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc - Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product. - Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc. - Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA. Lead design reviews and present design summary to management, highlight risks with mitigation plans. - Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers. - Design and coordinate with PI/SI engineers to simulate high-speed interfaces, RF traces, dc and ac PI analysis, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling - Interact with program manager, buyer/planner and suppliers to make sure designed parts are available in a timely manner for build. - Troubleshooting and performance optimization of the sub-system/transceiver module board. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Required Skills: Bachelor’s degree with 6+ years of experience or Masters degree 4+ years of experience or PHD with 2+ in Electrical Engineering or similar STEM field. 3+ years of experience in the following: - HW/circuit design, Schematic design and Layout floor planning - Experienced in Cadence tools for schematic and layout - High density and high-speed multiple-layer board design. - Voltage regulator, uController, DAC/ADCs component selection, design and layout optimization to meet product requirements - PCB and product bring up, laboratory optical and electrical measurement skills. - High speed Tline design and layout guidelines (25-50G NRZ, 100Gbps PAM4 and above) - Understand principles of micro-controller and communication protocols such as SPI, I2C, MDIO, CMIS management interface for optical modules. Preferred Skills: - Experience working with high volume PCB/substrate fab houses. Selecting PCB stackup that meets product requirement. - Experience with electronics CAD tools and modeling. Experience in PI and SI simulations is a plus. - Knowledge of transceiver/test board electrical design principles, including module architecture, high speed signal integrity, crosstalk, power integrity, noise, soft start, ESD, FW, testing, etc. - Experienced in layout and able to direct layout engineer with clear design priority - Experience working with AWG, DCAM, VNA/LCA to characterize high speed performance. - Strong communication and presentation skills. Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.