AMD—Lead Full Chip Floorplan Design Engineer

Job description

Description: ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: We at AECG SSD Custom Silicon are seeking a highly motivated and experienced Full-Chip Floorplan Engineer to drive physical implementation planning for complex SoCs and ASICs. The candidate will be responsible for developing and optimizing full-chip floorplans, partitioning strategies, power planning, interconnect planning, and physical architecture to achieve aggressive PPA (Power, Performance, Area) targets while ensuring design convergence and manufacturability. The role requires close collaboration with Architecture, RTL, Physical Design, DFT, Power, Package, and Verification teams throughout the SoC development lifecycle. Industry full-chip floorplanning activities commonly include die shaping, macro placement, IO planning, power-domain planning, pin assignment, feedthrough planning, and physical integration strategy development. THE PERSON: A successful candidate will work with senior silicon design engineers. The candidate will be highly accurate and detail-oriented, possessing good communication and problem-solving skills. KEY RESPONSIBLITIES: - Full-Chip Floorplanning - Develop and own top-level SoC floorplan architecture. - Define chip aspect ratio, die size, partitioning strategy, and hierarchy planning. - Perform macro placement and optimization for timing, congestion, power, and thermal considerations. - Drive floorplan refinement through design milestones. - Define floorplan topology for large-scale SoCs containing multiple subsystems, hard IPs, memories, and third-party IPs. - Physical Architecture Planning - Develop and optimize: - Power domain strategy - Voltage island planning - Power grid architecture - Isolation and retention planning - Feedthrough strategy - Repeater insertion strategy - Boundary and channel planning - IO and Package Planning - Define chip-level IO placement strategy. - Collaborate with package teams on bump map optimization. - Drive chip-package co-design activities. - Optimize high-speed interface placement (PCIe, SerDes, C2C, DDR, Ethernet, etc.). - Interconnect & Timing Planning - Develop timing-driven floorplans. - Define physical partitions and timing boundaries. - Establish timing budgeting methodology across subsystems. - Plan clock distribution architecture and clock-domain placement. - Congestion, Power & Thermal Optimization - Identify congestion hotspots and implement mitigation strategies. - Drive early power estimation and thermal-aware floorplanning. - Optimize placement for PPA convergence. - Support EMIR-aware floorplan planning. - Cross-Functional Collaboration - Work closely with : - Architecture teams - RTL designers - Physical Design teams - DFT engineers - Packaging teams - Power methodology teams - Verification teams - Review subsystem floorplans and ensure full-chip integration readiness. - Methodology and Automation - Develop scripts and automation for floorplan generation and analysis. - Drive methodology improvements and best practices. - Enable scalable planning methodologies for next-generation SoCs. PREFERRED EXPERIENCE: - 12+ years of ASIC/SoC Physical Design experience with strong expertise in Full-Chip Floorplanning. ACADEMIC CREDENTIALS: - Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SR4 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. Responsibilities: THE ROLE: We at AECG SSD Custom Silicon are seeking a highly motivated and experienced Full-Chip Floorplan Engineer to drive physical implementation planning for complex SoCs and ASICs. The candidate will be responsible for developing and optimizing full-chip floorplans, partitioning strategies, power planning, interconnect planning, and physical architecture to achieve aggressive PPA (Power, Performance, Area) targets while ensuring design convergence and manufacturability. The role requires close collaboration with Architecture, RTL, Physical Design, DFT, Power, Package, and Verification teams throughout the SoC development lifecycle. Industry full-chip floorplanning activities commonly include die shaping, macro placement, IO planning, power-domain planning, pin assignment, feedthrough planning, and physical integration strategy development. THE PERSON: A successful candidate will work with senior silicon design engineers. The candidate will be highly accurate and detail-oriented, possessing good communication and problem-solving skills. KEY RESPONSIBLITIES: - Full-Chip Floorplanning - Develop and own top-level SoC floorplan architecture. - Define chip aspect ratio, die size, partitioning strategy, and hierarchy planning. - Perform macro placement and optimization for timing, congestion, power, and thermal considerations. - Drive floorplan refinement through design milestones. - Define floorplan topology for large-scale SoCs containing multiple subsystems, hard IPs, memories, and third-party IPs. - Physical Architecture Planning - Develop and optimize: - Power domain strategy - Voltage island planning - Power grid architecture - Isolation and retention planning - Feedthrough strategy - Repeater insertion strategy - Boundary and channel planning - IO and Package Planning - Define chip-level IO placement strategy. - Collaborate with package teams on bump map optimization. - Drive chip-package co-design activities. - Optimize high-speed interface placement (PCIe, SerDes, C2C, DDR, Ethernet, etc.). - Interconnect & Timing Planning - Develop timing-driven floorplans. - Define physical partitions and timing boundaries. - Establish timing budgeting methodology across subsystems. - Plan clock distribution architecture and clock-domain placement. - Congestion, Power & Thermal Optimization - Identify congestion hotspots and implement mitigation strategies. - Drive early power estimation and thermal-aware floorplanning. - Optimize placement for PPA convergence. - Support EMIR-aware floorplan planning. - Cross-Functional Collaboration - Work closely with : - Architecture teams - RTL designers - Physical Design teams - DFT engineers - Packaging teams - Power methodology teams - Verification teams - Review subsystem floorplans and ensure full-chip integration readiness. - Methodology and Automation - Develop scripts and automation for floorplan generation and analysis. - Drive methodology improvements and best practices. - Enable scalable planning methodologies for next-generation SoCs. PREFERRED EXPERIENCE: - 12+ years of ASIC/SoC Physical Design experience with strong expertise in Full-Chip Floorplanning. ACADEMIC CREDENTIALS: - Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SR4