Bajaj Auto—Telematics & Connectivity Hardware

Job description

Description: Division R&D Department EV Electronics Level Ex Functional Area Telematics, Cluster, ARAS 1 Job Title Manager (R&D) 2 Reporting Leadership, R&D – EV Electronics 3 Educational Qualification Essential: B.E/ B Tech in Electrical, Electronics/Instrumentation M Tech in Electronics is preferred; Min. 70% required at all levels of education Experience Minimum: 3 Maximum: 12 Age Limit Minimum: 26 Maximum: 34 4 Job Role & Responsibilities Role: Connectivity solutions hardware - Design and develop automotive-grade electronic hardware for Electric Vehicle (EV) systems including Telematics Control Units (TCU), Instrument Clusters, Access Control Modules, Infotainment Systems, and connected vehicle platforms. - Define hardware architectures and perform circuit design for mixed-signal, high-speed digital, RF, power management, sensor interface, and communication subsystems. - Design and optimize RF hardware including antenna interfaces, matching networks, RF front-end circuits, filters, LNAs, protection circuits, and wireless connectivity modules supporting 4G/5G/LTE, NB-IoT, GNSS, BLE, and Wi-Fi technologies. - Develop robust power architectures incorporating DC-DC converters, LDOs, battery protection, and automotive transient/surge immunity circuits compliant with automotive standards. - Design hardware interfaces for secure elements, SIM/eSIM, memory devices, displays, touch interfaces, backlight systems, and vehicle sensors such as IMUs, radar, ultrasonic, and environmental sensors. - Implement and validate digital communication interfaces including CAN/CAN-FD, Automotive Ethernet, UART, SPI, I²C, USB, LIN, and high-speed serial interfaces. - Perform detailed schematic design, component selection, tolerance analysis, derating analysis, worst-case circuit analysis, and reliability assessments. - Develop complete hardware design documentation including system architecture, block diagrams, schematics, BOMs, design calculations, validation plans, and manufacturing documentation. - Lead PCB design activities including stack-up definition, component placement, signal integrity considerations, power integrity optimization, grounding strategy, and routing reviews. - Design for EMI/EMC compliance through appropriate filtering, shielding, grounding, isolation, and layout techniques to meet automotive regulatory and OEM requirements. - Conduct circuit simulations and analyses including SPICE simulations, power integrity analysis, signal integrity evaluation, thermal assessment, and Monte Carlo simulations. - Execute hardware bring-up, board validation, debugging, root-cause analysis, and failure investigations using laboratory instruments such as oscilloscopes, spectrum analyzers, network analyzers, logic analyzers, and power analyzers. - Support environmental, reliability, EMC/EMI, and regulatory qualification testing and drive corrective actions for identified issues. - Collaborate closely with firmware, software, mechanical, and system engineering teams to ensure seamless hardware-software integration and overall system performance. - Interface with semiconductor vendors, PCB manufacturers, EMS partners, and component suppliers to support prototype development, DFM/DFT reviews, production readiness, and cost optimization. - Drive hardware design improvements focused on reliability, manufacturability, testability, cost reduction, component lifecycle management, and production yield enhancement. - Evaluate hardware consolidation opportunities and next-generation ECU architectures to optimize system cost, packaging efficiency, power consumption, and functional integration. 5 Competency Requirements Behavioural: - Promotes and champions change - Strong team player with the ability to lead/mentor group of engineers. - Demonstrates proactive thinking, anticipating issues and taking timely action. - Maintains high standards of technical documentation, including design calculations and engineering reports. - Encourage technology and cost innovation within the team along with IP generation - Ability to translate concepts into practical real-world solutions. - Effective communication with team, peers, suppliers and leadership (written and oral communications) - Collaborates with cross-functional teams to develop innovative solutions. Specific expertise required for functional areas: - Knowledge of electric vehicle standards and regulations, including ISO 26262 (Functional Safety), CISPR/ISO (EMC), ISO 7637, and AIS standards. - Familiarity with the automotive product development lifecycle - Strong understanding of DFSS (Design for Six Sigma) methodology. - Strong fundamentals in analog, digital, and mixed-signal electronics. - Proficiency in schematic design, circuit analysis, and simulations. - Hands-on experience with PCB layout reviews, SI/PI considerations for automotive hardware. - Experience in designing hardware for automotive-grade performance, reliability, optimization, and cost efficiency. - Hands-on experience with LTE/4G/5G/NB-IoT modems, GNSS receivers, BLE, and Wi-Fi SoCs. - Strong understanding of RF fundamentals including antenna design, impedance matching, return loss, VSWR, filter design, and sensitivity optimization. - Ability to perform RF validation and troubleshoot wireless performance issues. - Familiarity with vehicle communication protocols: CAN, LIN, UART, SPI, I2C, and related debugging/analysis tools. - Experience building low-noise analog front ends, sensor interfaces, and signal-conditioning circuits. - Proficient in using laboratory test equipment: Oscilloscope, DMM, LCR meter, Network Analyzer, Spectrum Analyzer, Power Analyzer, and related diagnostic tools. 6 Likely Sources Bosch, Philips, Continental, Vitesco, Valeo, Aptiv, Harman, KPIT, Denso, ZF, Hella, Honeywell, Ather, OLA, Honda, Ultraviolette, Raptee, Ford, EVA, Hero, Tata motors, Hyundai Mobis, etc