AMD—PD IREM LEAD

Job description

Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. 🔹 THE ROLE As a PHY‑V Lead, you will own physical verification sign-off, full-chip integration, and packaging interface (RDL) planning for advanced SoC programs. You will drive DRC/LVS clean tapeouts, integration quality, and sign-off predictability across complex multi-IP designs. This role requires strong expertise in physical verification, top-level integration, and advanced packaging alignment, along with the ability to lead cross-functional execution across PD, Analog, and Packaging teams. 🔹 THE PERSON - Strong technical leader with deep PD + Physical Verification understanding - Proven ownership of sign-off closure for complex SoCs - Ability to drive execution across multiple teams and dependencies - Detail-oriented with focus on quality, manufacturability, and schedule predictability - Comfortable operating in high-pressure tapeout environments 🔹 KEY RESPONSIBILITIES ✅ Physical Verification & Sign-off Ownership - Drive end-to-end DRC, LVS, ERC, antenna closure at block and full-chip level - Define and enforce sign-off methodology and quality criteria - Own foundry rule decks, waivers, and risk assessments - Deliver sign-off clean GDS for tapeout ✅ SoC / Full-Chip Integration - Lead top-level integration of IPs/macros into SoC - Own: - GDS assembly - Hierarchical LVS reconciliation - Resolve: - Boundary issues - Connectivity mismatches - Integration conflicts - Ensure robust integration across internal and third-party IPs ✅ RDL & Packaging Integration - Drive RDL planning and bump mapping strategy - Define IO escape routing and die–package interface - Collaborate with Packaging, SI/PI, and system teams - Enable flip-chip / 2.5D / 3D integration readiness ✅ Tapeout Execution & Tracking - Own sign-off checklist, closure tracking, and tapeout readiness - Lead tapeout reviews and milestone tracking - Drive cross-team closure to meet schedule and quality targets ✅ Methodology & Flow Development - Define and improve physical verification flows (Calibre/ICV/Pegasus) - Drive: - Automation (TCL/Python) - Runtime optimization - Debug efficiency - Establish best practices for hierarchical and incremental sign-off ✅ Debug & Issue Resolution - Lead debug of: - Complex DRC violations - LVS mismatches (shorts/opens/connectivity issues) - Drive closure with PD/layout teams - Minimize waivers and ensure risk-managed sign-off ✅ Leadership & Collaboration - Lead and mentor PHY‑V engineers - Act as primary escalation point for sign-off issues - Interface with: - PD / PnR teams - Analog/layout teams - Packaging and foundry teams 🔹 REQUIRED QUALIFICATIONS - B.Tech / M.Tech in Electronics / Electrical Engineering - 10–15+ years in Physical Design / Physical Verification / SoC Integration - Strong expertise in: - DRC, LVS, ERC, antenna checks - Tools: Calibre / ICV / Pegasus - Solid understanding of: - Full PD flow (RTL → GDS → sign-off) - Advanced process nodes (7nm and below) 🔹 PREFERRED QUALIFICATIONS - Experience in: - Full-chip SoC integration and GDS assembly - RDL planning and advanced packaging flows - Exposure to: - IR/EM, SI/PI, PEX, reliability checks - Chiplet / 2.5D / 3D-IC methodologies - Strong scripting (TCL/Python) for automation - #LI-BM2 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. Responsibilities: 🔹 THE ROLE As a PHY‑V Lead, you will own physical verification sign-off, full-chip integration, and packaging interface (RDL) planning for advanced SoC programs. You will drive DRC/LVS clean tapeouts, integration quality, and sign-off predictability across complex multi-IP designs. This role requires strong expertise in physical verification, top-level integration, and advanced packaging alignment, along with the ability to lead cross-functional execution across PD, Analog, and Packaging teams. 🔹 THE PERSON - Strong technical leader with deep PD + Physical Verification understanding - Proven ownership of sign-off closure for complex SoCs - Ability to drive execution across multiple teams and dependencies - Detail-oriented with focus on quality, manufacturability, and schedule predictability - Comfortable operating in high-pressure tapeout environments 🔹 KEY RESPONSIBILITIES ✅ Physical Verification & Sign-off Ownership - Drive end-to-end DRC, LVS, ERC, antenna closure at block and full-chip level - Define and enforce sign-off methodology and quality criteria - Own foundry rule decks, waivers, and risk assessments - Deliver sign-off clean GDS for tapeout ✅ SoC / Full-Chip Integration - Lead top-level integration of IPs/macros into SoC - Own: - GDS assembly - Hierarchical LVS reconciliation - Resolve: - Boundary issues - Connectivity mismatches - Integration conflicts - Ensure robust integration across internal and third-party IPs ✅ RDL & Packaging Integration - Drive RDL planning and bump mapping strategy - Define IO escape routing and die–package interface - Collaborate with Packaging, SI/PI, and system teams - Enable flip-chip / 2.5D / 3D integration readiness ✅ Tapeout Execution & Tracking - Own sign-off checklist, closure tracking, and tapeout readiness - Lead tapeout reviews and milestone tracking - Drive cross-team closure to meet schedule and quality targets ✅ Methodology & Flow Development - Define and improve physical verification flows (Calibre/ICV/Pegasus) - Drive: - Automation (TCL/Python) - Runtime optimization - Debug efficiency - Establish best practices for hierarchical and incremental sign-off ✅ Debug & Issue Resolution - Lead debug of: - Complex DRC violations - LVS mismatches (shorts/opens/connectivity issues) - Drive closure with PD/layout teams - Minimize waivers and ensure risk-managed sign-off ✅ Leadership & Collaboration - Lead and mentor PHY‑V engineers - Act as primary escalation point for sign-off issues - Interface with: - PD / PnR teams - Analog/layout teams - Packaging and foundry teams 🔹 REQUIRED QUALIFICATIONS - B.Tech / M.Tech in Electronics / Electrical Engineering - 10–15+ years in Physical Design / Physical Verification / SoC Integration - Strong expertise in: - DRC, LVS, ERC, antenna checks - Tools: Calibre / ICV / Pegasus - Solid understanding of: - Full PD flow (RTL → GDS → sign-off) - Advanced process nodes (7nm and below) 🔹 PREFERRED QUALIFICATIONS - Experience in: - Full-chip SoC integration and GDS assembly - RDL planning and advanced packaging flows - Exposure to: - IR/EM, SI/PI, PEX, reliability checks - Chiplet / 2.5D / 3D-IC methodologies - Strong scripting (TCL/Python) for automation - #LI-BM2