AMD—Physical Design Lead(High Speed IP's)

Job description

Description: ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. MTS SILICON DESIGN ENGINEER THE ROLE AMD is looking for an experienced and highly motivated Member of Technical Staff (MTS) to join the CT Physical Design team. In this role, you will drive the physical implementation of industry-leading high-speed interface IPs including DDR, LPDDR, GDDR, PCIe, and other next-generation mixed-signal PHY solutions used across client, server, and graphics products. As a technical leader, you will work closely with architects, circuit designers, RTL, package, power integrity, signal integrity, SoC, and methodology teams to define and implement innovative physical design solutions that achieve aggressive PPA, frequency, power, and schedule goals on advanced process nodes. The ideal candidate combines deep physical design expertise with strong leadership capabilities and a proven track record of delivering complex, high-performance IPs to production. THE PERSON You are passionate about solving complex physical design challenges in advanced semiconductor technologies. You thrive in fast-paced environments, influence technical direction beyond your immediate team, and enjoy mentoring engineers while driving innovation in implementation methodologies. You possess deep understanding of high-speed digital and mixed-signal design implementation and have successfully delivered multiple tape-outs in advanced technology nodes. KEY RESPONSIBILITIES - Lead physical design implementation of complex high-speed IPs such as DDR/LPDDR/GDDR PHYs, PCIe, SerDes, and related subsystems. - Own end-to-end implementation activities including some or all of these domains: - Floorplanning - Power planning - Placement - Clock architecture - CTS - Timing closure - Signal integrity closure - Physical verification - Tapeout signoff - Drive high-frequency timing closure for challenging datapaths and clock distribution networks. - Partner with architects and circuit designers to optimize PHY architectures for performance, power, and implementation efficiency. - Develop and deploy innovative implementation methodologies to improve design quality, productivity, and scalability. - Collaborate with cross-functional teams including Architecture, RTL, AMS, Package, SI/PI, Product Engineering, SoC, CAD, and EDA vendors. - Mentor junior engineers and help grow the technical capability of the organization. - Drive continuous improvement initiatives in automation, AI-assisted design methodologies, and signoff flows. PREFERRED EXPERIENCE - 10+ years of industry experience in Physical Design for advanced semiconductor products. - Proven track record delivering multiple successful tape-outs on advanced technology nodes (N3/N4/N5 or equivalent). - Experience closing timing at aggressive frequencies and implementing complex clocking structures. - Expertise with industry-standard EDA tools including Cadence and Synopsys implementation/signoff flows. - Experience driving methodology development and automation. - Demonstrated leadership across cross-functional teams and geographies. TECHNICAL SKILLS - Physical Design and Signoff - STA and Timing Closure - Clock Architecture and CTS - Floorplanning and Power Planning - IR/EM Analysis - Physical Verification - SI/PI Analysis - Low Power Design (UPF/CPF) - Advanced Node Design Methodologies - Tcl/Python/Scripting - AI-assisted Design Flows (preferred) LEADERSHIP EXPECTATIONS - Leads strategic technical initiatives across multiple IP programs. - Mentors and develops engineering talent. - Drives innovation that improves product competitiveness, engineering productivity, and design quality. EDUCATION - BS/MS in Electrical Engineering, Computer Engineering, VLSI Design, or related field. #LI-PM2 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. Responsibilities: MTS SILICON DESIGN ENGINEER THE ROLE AMD is looking for an experienced and highly motivated Member of Technical Staff (MTS) to join the CT Physical Design team. In this role, you will drive the physical implementation of industry-leading high-speed interface IPs including DDR, LPDDR, GDDR, PCIe, and other next-generation mixed-signal PHY solutions used across client, server, and graphics products. As a technical leader, you will work closely with architects, circuit designers, RTL, package, power integrity, signal integrity, SoC, and methodology teams to define and implement innovative physical design solutions that achieve aggressive PPA, frequency, power, and schedule goals on advanced process nodes. The ideal candidate combines deep physical design expertise with strong leadership capabilities and a proven track record of delivering complex, high-performance IPs to production. THE PERSON You are passionate about solving complex physical design challenges in advanced semiconductor technologies. You thrive in fast-paced environments, influence technical direction beyond your immediate team, and enjoy mentoring engineers while driving innovation in implementation methodologies. You possess deep understanding of high-speed digital and mixed-signal design implementation and have successfully delivered multiple tape-outs in advanced technology nodes. KEY RESPONSIBILITIES - Lead physical design implementation of complex high-speed IPs such as DDR/LPDDR/GDDR PHYs, PCIe, SerDes, and related subsystems. - Own end-to-end implementation activities including some or all of these domains: - Floorplanning - Power planning - Placement - Clock architecture - CTS - Timing closure - Signal integrity closure - Physical verification - Tapeout signoff - Drive high-frequency timing closure for challenging datapaths and clock distribution networks. - Partner with architects and circuit designers to optimize PHY architectures for performance, power, and implementation efficiency. - Develop and deploy innovative implementation methodologies to improve design quality, productivity, and scalability. - Collaborate with cross-functional teams including Architecture, RTL, AMS, Package, SI/PI, Product Engineering, SoC, CAD, and EDA vendors. - Mentor junior engineers and help grow the technical capability of the organization. - Drive continuous improvement initiatives in automation, AI-assisted design methodologies, and signoff flows. PREFERRED EXPERIENCE - 10+ years of industry experience in Physical Design for advanced semiconductor products. - Proven track record delivering multiple successful tape-outs on advanced technology nodes (N3/N4/N5 or equivalent). - Experience closing timing at aggressive frequencies and implementing complex clocking structures. - Expertise with industry-standard EDA tools including Cadence and Synopsys implementation/signoff flows. - Experience driving methodology development and automation. - Demonstrated leadership across cross-functional teams and geographies. TECHNICAL SKILLS - Physical Design and Signoff - STA and Timing Closure - Clock Architecture and CTS - Floorplanning and Power Planning - IR/EM Analysis - Physical Verification - SI/PI Analysis - Low Power Design (UPF/CPF) - Advanced Node Design Methodologies - Tcl/Python/Scripting - AI-assisted Design Flows (preferred) LEADERSHIP EXPECTATIONS - Leads strategic technical initiatives across multiple IP programs. - Mentors and develops engineering talent. - Drives innovation that improves product competitiveness, engineering productivity, and design quality. EDUCATION - BS/MS in Electrical Engineering, Computer Engineering, VLSI Design, or related field. #LI-PM2