AMD—SOC Subsystem Physical Design Lead

Job description

Description: ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: The focus of this role is to plan, implement, and execute the physical design and verification of processing subsystems IP, resulting in meeting the signoff criteria for tapeout.     THE PERSON:  You have a passion for modern, complex processor architecture, digital design, and Implementation in general. You are a team player who has excellent communication skills and experience collaborating with other engineers located in different sites/timezones. You have strong analytical and problem-solving skills and are willing to learn and ready to take on problems.    PREFERRED EXPERIENCE:  - 12+ Years of experience in relevant domain. - Experienced with Blocklevel and toplevel physical implementation. - Good understanding and hands-on experience in lower node technologies. (5nm or below) - Preferably working on low power or processor designs. - Proficient in Working with various EDA tools. Innovus, Fusion compiler/ICCompiler2, Primetime etc. - Scripting language experience: TCL, Python preferred.   - Exposure to leadership or mentorship is an asset   ACADEMIC CREDENTIALS:  - Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SS1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. Responsibilities: THE ROLE: The focus of this role is to plan, implement, and execute the physical design and verification of processing subsystems IP, resulting in meeting the signoff criteria for tapeout.     THE PERSON:  You have a passion for modern, complex processor architecture, digital design, and Implementation in general. You are a team player who has excellent communication skills and experience collaborating with other engineers located in different sites/timezones. You have strong analytical and problem-solving skills and are willing to learn and ready to take on problems.    PREFERRED EXPERIENCE:  - 12+ Years of experience in relevant domain. - Experienced with Blocklevel and toplevel physical implementation. - Good understanding and hands-on experience in lower node technologies. (5nm or below) - Preferably working on low power or processor designs. - Proficient in Working with various EDA tools. Innovus, Fusion compiler/ICCompiler2, Primetime etc. - Scripting language experience: TCL, Python preferred.   - Exposure to leadership or mentorship is an asset   ACADEMIC CREDENTIALS:  - Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SS1