IPP Software/Firmware Engineering Team Lead

Rockwell Automation is a global technology leader focused on helping the world’s manufacturers be more productive, sustainable, and agile. With more than 28,000 employees who make the world better every day, we know we have something special. Behind our customers - amazing companies that help feed the world, provide life-saving medicine on a global scale, and focus on clean water and green mobility - our people are energized problem solvers that take pride in how the work we do changes the world for the better.

We welcome all makers, forward thinkers, and problem solvers who are looking for a place to do their best work. And if that’s you we would love to have you join us!

Job Description Position Summary Job Summary: As the Intelligent Packaged Power (IPP) SW/FW Engineering Team Lead, you will lead the IPP software and firmware engineering resources based in Pune. Your scope will include the LVMCC Software Engineering Team and the MVB Firmware Engineering Team. You will combine people leadership, technical direction, and execution leadership to allow secure, reliable, and high-quality embedded firmware and industrial software solutions. You will work in partnership with the designated Scrum Masters. You will collaborate with global teams, including engineering, product management, quality, cybersecurity, test, and operations teams. These collaborations will align priorities, manage dependencies, and deliver integrated solutions for IPP products and platforms. You will report to the Global Engineering Director – IPP and will work in hybrid schedule based in Pune, Hinjewadi.