Tata Electronics
Wirebond Process Engineering Lead
- Location Jagiroad, AS, IN
- Experience 5-7 yrs
- Job type Full-time
- Posted 11 Oct 2026
You will be taken to Tata Electronics’s own careers page to apply. Job ID 55321844.
Job description
Process Engineering head will provide technical and organizational leadership for end-to-end IC packaging process development, high volume manufacturing readiness, and continuous improvement across wirebond and flip chip technologies. The role is accountable for process yield, reliability, cost, scalability and technology roadmap execution, while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.
Key Responsibilities
- Technology & Process Leadership.
- Own end-to-end process integration for
- Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection)
- Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering)
- Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond)
- Underfill, Plasma clean
- Taping & 3rd Optical
- Encapsulation (Transfer Mold, Compression Mold and Lid attach)
- Plating & Marking
- Solder ball attach, Reflow and Flux cleaning
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- Package Separation (Cutting, Forming, Singulation) & FV Inspection.
- Define and maintain process windows, control plans and CTQ across all package families.
- Lead technology qualification, scaling from development to high volume manufacturing.